中文簡(jiǎn)介

IEEE《半導(dǎo)體制造學(xué)報(bào)》發(fā)表了與微電子和光子元件及集成系統(tǒng)(包括光伏器件和微電子機(jī)械系統(tǒng))制造有關(guān)的最新進(jìn)展。其主要目標(biāo)是不斷增強(qiáng)知識(shí)基礎(chǔ)和改善整個(gè)供應(yīng)鏈的制造實(shí)踐，從制造到交付這些設(shè)備。感興趣的領(lǐng)域包括過(guò)程集成、制造設(shè)備性能和建模、產(chǎn)量分析和增強(qiáng)、計(jì)量學(xué)、過(guò)程控制、材料處理、工廠系統(tǒng)以及與半導(dǎo)體行業(yè)相關(guān)的所有工廠和供應(yīng)鏈管理領(lǐng)域，包括材料合成、設(shè)備制造和掩模制造。提交給本雜志的論文應(yīng)該與制造實(shí)踐有明確的相關(guān)性，而不是設(shè)備設(shè)計(jì)和設(shè)備特性。

　　英文簡(jiǎn)介

The IEEE Transactions on Semiconductor Manufacturing publishes the latest advances related to the manufacture of microelectronic and photonic components and integrated systems, including photovoltaic devices and micro-electro-mechanical systems. Its principal aim is to continually enhance the knowledge base and improve manufacturing practice across the entire supply chain from fabrication to delivery of these devices. Areas of interest include process integration, manufacturing equipment performance and modeling, yield analysis and enhancement, metrology, process control, material handling, factory systems and all areas of factory and supply chain management related to the semiconductor industry including materials synthesis, equipment manufacturing, and mask making. Papers submitted to this journal should have a clear relevance to manufacturing practice, as opposed to device design and device characterization.

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