中文簡介

電子包裝雜志發表論文，使用實驗和理論(分析和計算機輔助)的方法、方法和技術來解決和解決在電子和光子學組件、設備和系統的分析、設計、制造、測試和操作中遇到的各種機械、材料和可靠性問題。

　　英文簡介

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

　　近年期刊自引率趨勢圖

　　JCR分區

JCR分區等級	JCR所屬學科	分區	影響因子
Q3	ENGINEERING, ELECTRICAL & ELECTRONIC	Q3	1.931
	ENGINEERING, MECHANICAL	Q3

　　近年期刊影響因子趨勢圖

　　CiteScore數值

CiteScore	SJR	SNIP	學科類別	分區	排名	百分位
3.70	0.493	0.861	大類：Engineering 小類：Mechanics of Materials	Q2	145 / 384	62%
			大類：Engineering 小類：Electrical and Electronic Engineering	Q2	284 / 708	59%
			大類：Engineering 小類：Computer Science Applications	Q2	307 / 747	58%
			大類：Engineering 小類：Electronic, Optical and Magnetic Materials	Q2	122 / 259	53%

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